How neural network-based AI systems perform under the hood is currently unknown, but the industry is finding ways to live ...

This is where a shift-left strategy comes in. Analysis of the multiphysics effects of 3D-ICs (thermal, mechanical, etc.) in ...

There are two commonalities in all perspectives. Clearly, the flat, fully distributed architectures are a thing of the past. And all perspectives eventually arrive at some form of fully centralized ...

By 2030, 6G is expected to be commercially available, revolutionizing connectivity with lightning-fast speeds, unprecedented ...

Large EDA companies are looking at huge new opportunities that reach well beyond semiconductors, combining large-scale ...

Alongside the high parallelism and high connectivity of wave optics, the chiplet explores a general and iterative ...

New technical papers recently added to Semiconductor Engineering’s library.

Increasingly tight tolerances and rigorous demands for quality are forcing chipmakers and equipment manufacturers to ferret out minor process variances, which can create significant anomalies in ...

TSMC, SK hynix HBM deal; Intel's high-NA EUV; big haul for Micron, Samsung; Cadence's new emulation, prototyping systems; ...

A new technical paper titled “Combining Power and Arithmetic Optimization via Datapath Rewriting” was published by researchers at Intel Corporation and Imperial College London. “Industrial datapath ...